Honkai Impact 3rd - Elysia Mobile Device Cooler B7X miHoYo

Manufacturer: miHoYo

Cooling Method: Semiconductor Cooling

Dimensions (approx.):

• Cooler: Approximately 63.5 mm (diameter) x 25 mm (H)
• Magnetic Suction Plate: Approximately 62 × 57 mm

*Official Product*

Contain: Elysia Mobile Device Cooler + Elysia Magnetic Pad + Type-C to Type-C Cable

Feature:

• Adaptive Frequency Temperature Control, High-Efficiency Cooling

1. Intelligent adaptive frequency – high-efficiency cooling
   
2. Intelligent temperature control – safe to your mobile devices
   
3. Super low noise – good to use during livestream
   
4. Super strong magnetic suction – better convenience
   

1. Low Load – Automatic switching between 10-27w
2. High Load – Automatic switching to full power operation

1. 3 precision sensors for monitoring the temperature of the phone
2. 27W high-efficiency overclocking
3. PID chip
4. 36mm x 36mm² large refrigeration plate with all-silicone grease
5. Through-hole design: large heat dissipation fins
   

1. Directly adheres to Apple iPhone 12 or above. Requires a magnetic pad for attaching to Android phones/tablets
2. Compact & Unobtrusive, Weighing Only 93g

Tips:

1. Iphone 12 and above can be directly adsorbed, while other users need to use built-in magnetic suction pads for adsorption
2. A charging head of 30W or above can be used normally
3. A regular power bank cannot run at full power, with a heat dissipation effect of about 70 points. To run at full power, a fast charging power bank of 30W or above is required
4. The innovative spring steel material of the magnetic suction plate is as thin as 0.15mm, which does not affect the cooling effect and is easy to peel off
5. The phone case can provide a certain cooling effect. It is recommended to remove the case and use it to maximize the performance of the heat sink